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Carbide Blank(EDM)
carbide plate

Carbide Blank(EDM)

Recommended Grades
We offer various type of Carbide Blanks with different grades for Semi-Conductor and Stamping Dies.

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Features

Carbide performs for punching dies Industry Applications:

Carbide for IC packaging

Carbide for leadframe

Carbide for connector

Carbide for silicon chip


Carbide blanks which are not shown in following table can be also made according to customer's request.
Specification
GRADE Binder Grain Size Density Hardness T.R.S K1C Referenced Grades
% ±0.1 g/cm3 ±0.3 HRA ±50 HV10 >N/mm2
CU 25 13 Submicron 14.2 92.0 1630 3900 10.2 F10 / TSM40 / FB15 / EF10
CU 35 15 14.0 91.5 1550 3900 10.6 H15F / MG30
CU 50 18 13.7 90.7 1450 3900 11.3 EF20 / FB20
         
CD 10 10 Fine 14.5 91.7 1590 3600 10.4 NC6 / CF-H25S / KD10
CD 20 12.5 14.2 90.8 1460 3700 11.1 CF-H40S / KD20
CD 30 15 14.0 90.0 1360 3800 11.9 CD650
         
CM 20 CM 14.9 90.2   3400 15.0 MC20
         
CG 25 7 Medium 14.7 90.1 1430 3500 12.8 H20S / KG2
CG 35 9 14.5 89.2 1340 3600 14.1 H30S / KG3
CG 50 12 14.3 88.2 1220 3700 15.3 H40S / KG5
CG 65 14 14.0 87.0 1080 3400 17.0  
CG 80 18 13.6 86.0 1000 3500 18.7  
         
CT 40 12 Coarse 14.2 87.0 1080 3400 21.0 B40S
CT 55 15 13.9 86.0 1000 3200 22.1 NC12 / ST6
CT 70 18 13.6 85.0 920 2900 23.2 ST7 / EA65 / VA70
CT 80 20 13.4 84.0 840 2600 24.0 NC14 / VA80
CT 90 22 13.2 83.0 760 2100 24.7 NC16 / VA90
CT 95 25 13.0 82.0 640 3400 25.5 EA90 / VA95
*All above grades are HIP treated.
*CYC keeps improving its products. Any change on above grade may make without written notice.
Grade
Density
(g/cm³)
T.R.S
(Mpa)
Hardness
(HRA)

F50

13.9

3900

91.8

F40

14.3

3500

91.0

D30

14.3

3600

88.5

Specification

Tolerance:  L/W  +1.0 / -0 mm        T: +0.2 / -0 mm
Carbide plate
L  mm W  mm T  mm
105 105

1.0
2.0
3.0
.
.
50.0

History
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