Grade | Binder | Grain Size | Density | Hardness | T.R.S | Referenced Grades | Applications Example |
---|---|---|---|---|---|---|---|
(%) | ≥N/mm2 | ||||||
MH10F | 10 | Submicron | 14.45 | 91.8 | 3800 | FD15/FB15/EF10 | Excellent wear resistance, suitable for progressive dies, for stamping of semi-conductor, Icpackaging, leadframe. |
MH12S | 12 | 14.15 | 91.6 | 4100 | EF12 | ||
DF20 | 12.5 | Fine | 14.15 | 90.7 | 3800 | CF-H40S/KD20/RD25 | Excellent wear and shock, suitable for stamping tools for cinnector, terminals, silicon chips etc. Also good for powder compacting nibs, drawing dies. |
DF30 | 15 | 14 | 89.8 | 3800 | CD650/RD50 | ||
CM20 | 6 | Medium | 14.9 | 90.6 | 2800 | MC20 | Excellent wear and shock, suitable for stamping tools for pure copper and iron. |
CG25 | 7 | Medium | 14.75 | 90.2 | 3200 | H20S/KG2/RD30 | Good wear and shock, suitable for powder compacting nibs,(deep)drawing dies, hot forging dies. |
CG35 | 9 | 14.55 | 89.3 | 3400 | H30S/KG3/REA35 | ||
DM50 | 12 | 14.2 | 88.2 | 3500 | H40S/KG5/RD60 | ||
CG65 | 15 | 13.95 | 87 | 3600 | NC8/KG6/REA65 | ||
CT55 | 15 | Coarse | 13.95 | 86 | 2800 | NC12/ST6/EA60 | Excellent shock resistance, suitable for foging heading, punching and reducing dies. |
CT70 | 18 | 13.6 | 85 | 2700 | ST7/EA65/VA70 | ||
CT80 | 20 | 13.45 | 84 | 2600 | NC14/VA80 | ||
CT90 | 22 | 13.25 | 83 | 2500 | NC16/VA90 | ||
CT95 | 25 | 13 | 82.5 | 2400 | EA90/VA95 |