Products

Tungsten carbide for molding

Grade Chart
Grade Binder Grain Size Density Hardness T.R.S Referenced Grades Applications Example
(%) ≥N/mm2
MH10F 10 Submicron 14.45 91.8 3800 FD15/FB15/EF10 Excellent wear resistance, suitable for progressive dies, for stamping of semi-conductor, Icpackaging, leadframe.
MH12S 12 14.15 91.6 4100 EF12
DF20 12.5 Fine 14.15 90.7 3800 CF-H40S/KD20/RD25 Excellent wear and shock, suitable for stamping tools for cinnector, terminals, silicon chips etc. Also good for powder compacting nibs, drawing dies.
DF30 15 14 89.8 3800 CD650/RD50
CM20 6 Medium 14.9 90.6 2800 MC20 Excellent wear and shock, suitable for stamping tools for pure copper and iron.
CG25 7 Medium 14.75 90.2 3200 H20S/KG2/RD30 Good wear and shock, suitable for powder compacting nibs,(deep)drawing dies, hot forging dies.
CG35 9 14.55 89.3 3400 H30S/KG3/REA35
DM50 12 14.2 88.2 3500 H40S/KG5/RD60
CG65 15 13.95 87 3600 NC8/KG6/REA65
CT55 15 Coarse 13.95 86 2800 NC12/ST6/EA60 Excellent shock resistance, suitable for foging heading, punching and reducing dies.
CT70 18 13.6 85 2700 ST7/EA65/VA70
CT80 20 13.45 84 2600 NC14/VA80
CT90 22 13.25 83 2500 NC16/VA90
CT95 25 13 82.5 2400 EA90/VA95
1-4 of 4
History
    3Inquiry